Wider 'Net-based tool diagnosis is becoming a remote possibility Applied enters yet another market segment with introduction of Swift implantation tool New head of silicon house foresees 5�19% rise in wafer reclaim prices IBM drops $5B bombshell; Pentagon opens parts cleaning plant; Cymer acquires ACX; Yield Dynamics moves to larger headquarters; NuTool enlarges facility Trecenti makes 300-mm chips; Motorola, Applied prove ability of 300-mm copper equipment set; Hyundai may keep Wales fab; Chartered weighs 300-mm option; Nanya to break ground on fab China to build countryàs largest wafer plant; Ashland expands chem plant; American-Japanese joint venture opens organometallic chemicals plant near Tokyo Israel gives Tower grant for new fab ASM to start up new assembly and test facility to double production of 300-mm vertical furnaces This Nobel does mean Jack Semicon Korea, SPIE Microlithography, and more ACM Research claims copper gains; IBM, Infineon, UMC make 0.13-�m chips; cleanroom market to grow by 2005; chipmaking book covers all Thermal desorber, plasma workstation, ground-quality monitor, aluminum sputtering target, ion implanter, UHP gas purifier, reticle inspection tool, deep-UV microscope, pressure control/flow monitors, PVD system, wafer sorter, topology analysis system, universal mass spectrometers, IPA drying system, IR gas monitor, dry photoresist stripper, ion gauge controller, cleanroom ceiling grid, water vapor pumps, postetch-residue remover, and more Keep your eyes on 17 Roadmap committee steers chipmakers onto faster route with ITRS update U.S. labor survey gives chipmakers high safety marks; critic doubts study’s validity Pelchem doubles production of octafluorocyclobutane Applied backs Taiwan R&D fund; Silterra touts fast ramp-up; Teamasia to build fab in Hyderabad Ion Systems moves Euro HQ; Eindhoven University receives software from Philips, Wright Williams & Kelly Semicon China, Semiconductor Safety Association conference, and more TSMC delivers first wafers; Dainippon builds tool plant SID adds two chapters; Delta Optoelectronics and Dow Chemical create more-readable screen
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Products & Services
Thin Film Equipment
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
Mass Spectrometers
Mass spectrometers separate ions by their mass-to-charge (m/z) ratios. They are used to identify compounds by the mass of one or more elements in the compound. They are also used to determine the isotopic composition of one or more elements in a compound.
Etchers and Etching Machines
Etchers and etching machines remove material from the surface of a part using an acid or alkaline chemical solution. Etchers and etching machines, also known as chemical milling machines, use masking substances to protect some surface areas of the part, providing selective material removal or patterning.
Wafer and Thin Film Instrumentation
Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.

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