The KA250 wafer carrier is molded of PEEK and a polycarbonate to ensure low-particulate operation and dimensional stability. The carrier's wafer and equipment contacts are made of Stat-Pro 3000, a static-dissipative PEEK material, while a polycarbonate is used in the frame and end wall. The design also ensures reliable equipment interface and robotic wafer transfer. StableWafer pocket design technology controls the wafer plane even when the wafer is removed from its pocket up to 21/2 in. from the fully seated position. This feature eliminates wafer chatter and flutter. Carriers can be colored red, blue, or green to differentiate wafer lots. End walls may also be a different color from the carrier's frame in order to extend color coding options. Additional identifying markers such as RF tags or adhesive bar code labels are also available. Designed for sub-0.15-µm metrology, the VeraSEM accommodates both 200- and 300-mm wafers and can be upgraded to measure critical dimensions on sub-0.13-µm geometries. The system's process variation monitoring technology uses a column design and special algorithms to measure line edge roughness, line edge width variation, and open or closed contact holes. A high-speed stage, fast wafer handling, and accurate measurement algorithms ensure high throughput. The Gencobot 9 servo-controlled robot offers repeatable indexing and transfer of wafers and flat-panel displays in vacuum processes >=108 torr. The robot's global positioning system ensures accurate transfer of 300-mm wafers. An optional yaw-axis feature eliminates the need for radial placement of process stations or cassettes around the robot. A variety of arm options permits the robot to transport an array of wafers, FPDs, and photomasks up
Products & Services
Semiconductor Cluster Tools
Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components.
Photolithography services create photomasks and use them to etch or engrave patterns on semiconductor substrates.
Thin Film Equipment
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
Cleanrooms are contamination-free environments where high-tech manufacturing and assembly take place.
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Production Spin Coat / Develop Cluster for Wafer Level Packaging - The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular...
Topics of Interest
The Titan robotic platform is designed to meet the reliability, repeatability, and durability needs of advanced IC manufacturing in 200- and 300-mm fabs. Features include brushless motors that...
009;A small-footprint single-wafer spin processor developed for 0.13-µm etching can handle 8-in. wafers and eventually will be offered in a 300-mm version. The design of the MP-2000 processor's...
Matrix S200 metrology systems for CMP and etch provide application-specific sets of metrology techniques. The S200 CMP system has a 5 ´ 10-mm-spot, 633-nm HeNe laser ellipsometer for measuring...
SuperMechatronics OEM automation robots ensure particle-free operation for handling 300-mm wafers. The cleanroom and vacuum robots are available in 2-, 3-, 4-, and 5-axis configurations. Incorporating...
The NovaLine A4005 is a 193-nm ultranarrow-bandwidth laser for optical lithography systems. The unit's line-narrowing optics and high repetition rate of 4 kHz yield an output power of 20 W at a...