Designed for inspecting wafers in CMP and other advanced interconnect processes, the ILM-2230 combines small-pixel, high-data-rate image processing with oblique-angle darkfield laser illumination for high-throughput production line monitoring. By reflecting light off the wafer at an angle instead of directly, darkfield illumination increases surface selectivity and suppresses noise caused by any granular features on the wafer surface. The tool's low-noise, high-speed sensor is specifically designed for darkfield illumination. The system can detect microscratches, residual metals and tungsten, pattern deformations, microbridging, and other yield-critical defects on devices with linewidths ¾0.25 µm. Two advanced optical filtering techniques facilitate collection of nonrepetitive defect signals and block noise from vertical and horizontal lines. In addition, the company's proprietary segmented autothreshold image processing technique integrated in the system enhances defect detection sensitivity on wafers with the metal and color variations found in CMP and metal etch processes. The PAS 5500/400 can process 96 200-mm wafers per hour and is capable of producing device resolutions down to 0.28 µm. The system incorporates a Carl Zeiss Starlith 400 i-line lens with a numerical aperture of 0.65. A 3.5-kW mercury arc lamp and a Carl Zeiss Aerial illuminator ensure high-volume throughput. The unit is designed to work together with the company's PAS 5500/500 DUV step-and-scan system, which can resolve critical device layers down to 0.18 µm. The DUV and i-line systems provide a mix-and-match solution for 0.22- to 0.18-µm lithography processes. Unlike step-and-repeat technology, the step-and-scan approach minimizes lens distortion, with matching between the PAS 5500/400 and 5000/500 systems specified at 70 nm. The Omega2000 cleaner/rinser/dryer produces particle-neutral hydrophobic or hydrophilic wafers @ 0.16 µm using motionless surface tension gradient technology. The system's CleanPoint filter removes particles >=0.065 µm from DI water. Mean time between failures is 3000 wafers. The system operates at room temperature, and the DI water
Products & Services
Semiconductor Wet Process Equipment
Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
Semiconductor Cluster Tools
Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components.
Fiber Optic Transmitters
Fiber optic transmitters are devices that include an LED or laser source, and signal conditioning electronics, to inject a signal into fiber.
Heat Lamps
Heat lamps are also known as infrared emitters, infrared bulbs, infrared tubes, or infrared lamps. Heat lamps differ from illuminating lamps in their low filament temperature, resulting in much less light and more infrared radiation.
Aluminum Extrusion Services
Aluminum extrusion services providers specialize in extruding aluminum and aluminum alloys into custom and standard profiles and shapes.
Product Announcements
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Lithography Cluster for Wafer Level Packaging
The LithoPack300 (LP300) lithography cluster consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LP300 is specifically...
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The MEI Evolution series wet processing systems are in-line, configurable, automated, modular, linear batch immersion wet systems made for high throughput at a low cost. Provides Dry in and dry out...
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Topics of Interest
Designed for making semiconductors with geometries 0.18 µm, the AIT II patterned process tool monitor minimizes the number of wafers exposed to out-of-control process conditions. The system...
and Anantha Sethuraman, Younsoo Ra, and Hawk Kim, A real-time classification system incorporates multiple modes of defect classification into a single estimate of the overall defect performance of the...
009;A Malaysian foundry plans to spend approximately $107 million on capital equipment as part of a major expansion plan. Silterra Malaysia will use the money at its Kulim site to add more...
The Titan robotic platform is designed to meet the reliability, repeatability, and durability needs of advanced IC manufacturing in 200- and 300-mm fabs. Features include brushless motors that...
Ingrid B. Peterson, Art D. Klaum, and Ed Hou, RQM aids in the understanding of reticle defect printability and optimizes return on investment by creating a reticle-sampling plan that takes into...
