Designed for inspecting wafers in CMP and other advanced interconnect processes, the ILM-2230 combines small-pixel, high-data-rate image processing with oblique-angle darkfield laser illumination for high-throughput production line monitoring. By reflecting light off the wafer at an angle instead of directly, darkfield illumination increases surface selectivity and suppresses noise caused by any granular features on the wafer surface. The tool's low-noise, high-speed sensor is specifically designed for darkfield illumination. The system can detect microscratches, residual metals and tungsten, pattern deformations, microbridging, and other yield-critical defects on devices with linewidths ¾0.25 µm. Two advanced optical filtering techniques facilitate collection of nonrepetitive defect signals and block noise from vertical and horizontal lines. In addition, the company's proprietary segmented autothreshold image processing technique integrated in the system enhances defect detection sensitivity on wafers with the metal and color variations found in CMP and metal etch processes. The PAS 5500/400 can process 96 200-mm wafers per hour and is capable of producing device resolutions down to 0.28 µm. The system incorporates a Carl Zeiss Starlith 400 i-line lens with a numerical aperture of 0.65. A 3.5-kW mercury arc lamp and a Carl Zeiss Aerial illuminator ensure high-volume throughput. The unit is designed to work together with the company's PAS 5500/500 DUV step-and-scan system, which can resolve critical device layers down to 0.18 µm. The DUV and i-line systems provide a mix-and-match solution for 0.22- to 0.18-µm lithography processes. Unlike step-and-repeat technology, the step-and-scan approach minimizes lens distortion, with matching between the PAS 5500/400 and 5000/500 systems specified at 70 nm. The Omega2000 cleaner/rinser/dryer produces particle-neutral hydrophobic or hydrophilic wafers @ 0.16 µm using motionless surface tension gradient technology. The system's CleanPoint filter removes particles >=0.065 µm from DI water. Mean time between failures is 3000 wafers. The system operates at room temperature, and the DI water
Products & Services
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Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
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Aluminum Extrusion Services
Aluminum extrusion services providers specialize in extruding aluminum and aluminum alloys into custom and standard profiles and shapes.
Lithography Cluster for Wafer Level Packaging
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