MICRO:Top 40 - Page 2 (Nov '99)

Series 1 D cleanroom connectors feature industry-standard threads for wide adaptability. They are made from a tube that has been widened to fit snugly into the sleeve of the fitting. Fastened to the fitting with a nut, the tube has an inside diameter that remains constant and unobstructed. Ultrapurity is maintained through a multistep system of cleaning, assembling, and packing. Connectors are ultrasonically cleaned, rinsed, dried, assembled, tested, and packed in two heat-sealed bags. To prevent the penetration of particles, the inner bag is filled with nitrogen. The connectors come in PVDF, PFA, or natural PP to ensure high resistance and ease of handling. Made of borosilicate, 300-mm dummy wafers can be used for testing, setup, and cycling of 300-mm process and handling equipment. The wafers meet or exceed SEMI M8-0997 Class C specifications. Notch profile is 1-mm radius ±0.25 mm. Measuring ~4000 Å, the coating is chromium with a silicon dioxide overcoat that is free of visible voids, pinholes, and scratches. The optical coating works with most sensor technologies. Wafers are also available without optical coating. Coated and noncoated wafers are available at specified prices for quantities of 1 to 5, 6 to 24, 25 to 99, and 100 or more. The PEP Iridia can perform both photoresist and residue removal operations in a single chamber without damaging chips or leaving residue. The dry-plasma process offers a lower cost of ownership than wet chemistries for such applications as postimplant resist and postetch residue removal. Using the Iridia module on the multichamber PEP platform can reduce the costs of chemicals, water, and waste disposal as well as lessen environmental impact. One configuration option is the Iridia