Demetre J. Economou and Theodoros L. Panagopoulos, Plans to introduce pilot lines and fabs for 300-mm wafer processing are well under way. A 300-mm wafer allows 2.4 to 2.7 times more die per wafer, and a 2540% reduction in per-die cost. At the same time, IC technology is moving toward 0.18-, 0.15-, and 0.13-µm linewidths. The combination of these two trends places unprecedented demands on wafer processing equipment and presents enormous challenges to equipment manufacturers. Their role in the IC business involves design and development of new-generation equipment as well as development and demonstration of processes compatible with such equipment. As a result, computational modeling is called on now more than ever to play a complementary role in equipment and process design. The development of models and computer simulation codes is being pursued vigorously at universities, government laboratories, and commercial vendors. The virtual reactor concept is close to becoming a reality. The transition from 200- to 300-mm wafer processing tools presents a clear problem in scale-up. Chemical engineers have had years of experience in scaling up chemical reactors from laboratory to pilot to full-production scale. When a system is too complicated to be analyzed by direct computer simulation, semiempirical methodologies may be implemented. One such methodology involves the use of dimensionless numbers or groups that describe the system's behavior. These numbers show the relative importance of one physical phenomenon versus another and appear naturally when the governing equations that describe the conservation of momentum, energy, and mass, and their respective boundary conditions are nondimensionalized. Dimensionless groups can be used as a guide for scale-up even when direct numerical simulation is possible. One simple example relates to the multiple-wafer-in-tube low-pressure chemical vapor deposition (LPCVD) reactor. In this system, wafers are placed in a tube parallel to one another, with the wafer axis
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MEMS Processing Equipment
MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers.
MEMS foundry services suppliers design and manufacture microelectromechanical devices on a contract basis, in prototype to production quantities.
Technology Computer-Aided Design Software (TCAD)
Technology computer-aided design software (TCAD) is used to simulate the fabrication process (but not the behavior) of semiconductor devices. TCAD software helps to optimize the semiconductor fabrication process and provides 2D modeling.
Topics of Interest
Experimental results from an SEA project suggest that single-wafer FOUP technology is a viable option for 300-mm fab and equipment automation schemes. The advent of 300-mm wafer processing brings new...
The availability of a single system to coordinate all machine control tasks will improve tool performance, throughput, and reliability. The transition from 200- to 300-mm wafers will bring a...
Dr. Phil Garrou Dow Chemical
Prof. Rao R. Tummala Georgia Institute of Technology
Explain the reasons for wafer-level packaging
Compare and contrast...
The 300-mm Age Has Finally Arrived But What about Its Long-Term Impact? is chief technology officer and senior vice president, semiconductor technology research, for The Noblemen Group ( ), a boutique...
The WaferSense autoleveling sensor is a wireless waferlike device that enables quick and accurate leveling of IC wafer processing and automation equipment. Designed to be handled like a 150-, 200-, or...