Chipmakers will require detection, inspection, and review technologies with particle sensitivities between 0.18 and 0.10 µm at greater throughputs than are currently available, according to the team heading up the defect reduction technology crosscut working group. The coordinating body also emphasizes that the tools will need some degree of artificial intelligence, such as automated defect classification and factory-integrated data management. Developing these capabilities will bring the industry closer to the total-system solution required for next-generation defect detection and prevention. Based on a cursory review of the earlier roadmaps, this assertion is one of three "key messages" discussed in a draft of the 1997 revision, which is once again being prepared by the Semiconductor Industry Association (SIA). First published in 1992 and revised in 1994, the SIA document focuses on the technologies required to manufacture successive generations of semiconductors to 2010. The roadmap
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and E. Dan Hirleman, Defect detection is considered a critical component of the defect reduction cycle. This motivated the defect reduction technology subgroup of the Crosscut Technology Working...

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