Product Technology News

A high-resolution 200-mm-wafer inspection tool, the XL810 features a Hexalens E-beam column that handles accelerating voltages of 200 V to 30 kV. The SEM-based system obtains resolutions better than 3 nm independent of beam voltage in the 1- to 30-kV range and switches directly between field-free and immersion modes. Pure secondary electron images for composition contrast result in enhanced grain-boundary imaging of metal lines and polysilicon, as well as enhanced contrast for contact-hole imaging. Samples can be rotated without affecting the resolution while keeping the defect in view at magnifications >20,000×. A Windows-based interface makes the XL810 easy to use. (Semicon/West, San Francisco, South Hall, Booth 2715) An x-y stage is made specifically for use with 300-mm wafers. Preloaded air bearings and precision granite reference surfaces provide straightness and flatness of travel below ±0.25 µm. Brushless linear servomotor drives allow velocities up to 800 mm/sec. Dual motors/encoders in the y-axis allow balanced drive and active yaw control. Positioning repeatabilities from ±0.025 to ±0.25 µm are achievable. The cleanroom-compatible system can be used in lithography and inspection. (Semicon/West, San Francisco, Gateway Hall, Booth 3103) The OmniClean 200-mm quartzware cleaner uses half the typical amount of DI water and cuts 25% off the cleaning time of related systems, according to the company. The unit's left chamber has a rotating carousel for pedestals, cantilevers, boats, and other