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From Taconic
The reasons for selecting circuit board are threefold. First, to allow the integration of digital and Radio Frequency (RF) circuitry into a single assembly. Second, to decrease overall printed circuit board (PCB) size. Third to provide additional thermal paths and increase the rigidity of the final assembly. There are basically two types of PTFE multilayers. One is an all PTFE substrate multilayer board (MLB) which is typically bonded with a low dielectric constant, low loss sheet adhesive or bonding film. The other is a hybrid or composite multilayer consisting of a layer (or layers) of PTFE and a layer (or layers) of a different material typically FR-4 bonded with a thermosetting prepeg. Products & Services
Printed circuit materials have copper-clad surfaces for the fabrication of electronic and electrical circuitry on printed circuit boards (PCBs), printed wiring boards (PWB) or flexible circuits.
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Packaging tapes and films are used to seal or wrap boxes, bottles or other packages.
Adhesive tapes and films temporarily or permanently join materials together.
Panels and panel materials are composite structures which consist of multiple layers or skins bonded to or sandwiching a core material such as multilayer sheets, cored laminates or industrial structural panels.
Product Announcements
Topics of Interest
Board designers are continually looking for ways to save weight and space in their applications and are moving toward higher count multilayer designs to solve these issues. Historically, PTFE...
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With PTFE’s low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF...
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With PTFE’s low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF...
(Read More)
Multilayer ceramic chip capacitors are renowned for their reliability but can be vulnerable to cracks when affected by PCB flexing. The resulting damage may not manifest itself immediately, but may...
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Taconic ADD publishes technical articles in trade magazines and presents technical papers at microwave conferences. We also receive technical articles from our customers and leading OEMs. We would...
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Technical Articles
PTFE And Hybrid Multilayer Bonding And Fabrication
- Surface Coating and Protection
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