Dr. Sundar M. Kamath
Prof. Rao R. Tummala
Georgia Institute of Technology
Understand the need for a single chip package
Innovative 3-D Solutions for Multiple-Die IC Packaging A variety of packaging options and processes enable medical device manufacturers to make the right choice to achieve the desired functionality...
Portability Drive Stokes Demand for Diminutive Pumps and Valves Tiny gas- and liquid-moving components fit the bill in smaller medical devices. Many medical devices are going home to do their test,...
4 THE CHIP SCALE PACKAGE, CSP
The Chip Scale Package introduced in the early 90s is essentially a smaller version of the BGA and represents the continuing trend in package miniaturization.
G nter Schiebel
Siemens Production and Logistics Systems AG
Advanced packages such as the ball grid array (BGA), chip scale package (CSP), and flip chip (FC) to a...