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Measurement & Analysis of Squeegee Force Settings and Traverse Pressure Distribution during Screen Printing

From Tekscan, Inc.
 

 
This brief highlights a method of electronically measuring the force and pressure distribution under a squeegee during the solder paste stenciling and screen-printing operation in PCB manufacturing.
Product Announcements
Akron Rubber Development Laboratory, Inc. (ARDL) - Wiper Blade Testing
ARDL offers Wiper Blade Testing services including, but not limited to, the following: •Durability Testing on Rubber Squeegee & Super Structure •FEA Design on Wiper Blade Super... (read more)
Wieland Electric Inc. - Through Hole Reflow Connectors
Wieland Electric expands its PCB connector offering to include Through Hole Reflow (THR) compatible headers and terminal blocks. Available in tape on reel, tray, or tubes to accommodate automated pick... (read more)
Tekscan, Inc. - Windshield Wiper Pressure Distribution
Windshield wiper system designers face many challenges when designing wiper systems that will effectively clean a windshield. Knowing the force distribution between the windshield and the blade at... (read more)
Protavic America, Inc. - Protavic® BNE-20220
Protavic® BNE-20220 is a die attach, electrically insulating, crystalline silica loaded, B-stageable epoxy adhesive. (read more)
Inovar Packaging Group - Labels
Inovar can provide you with high-quality and fast turn-around for your digital printing needs. Digital printing is extremely cost effective for short or long runs. It is an excellent option for trial... (read more)
Tekscan, Inc. - High-Temp FlexiForce Sensors
Tekscan, Inc., leading manufacturer of force and pressure measurement sensors, announces the release of the new High-Temp FlexiForce® Sensor (Model # HT201), measuring forces in environments as hot as... (read more)
Topics of Interest
Evergreen Solar manufactures photovoltaic modules for residential and commercial use. Production of solar cells is based on a process for growing crystalline silicon strips, a technology known as... (Read More)
Chapter List Chapter 17: NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING Chapter 18: FLIP CHIP ASSEMBLY AND UNDERFILLING Chapter 19: BGA AND CSP REWORK: WHAT IS INVOLVED? Chapter 20:... (Read More)
Overview Printing in Cocoa (as in MacApp and most other frameworks) is a simple operation for you to implement. At its most basic, you take a view that is displayed and pass it to a method that... (Read More)
In dispensing adhesives and solder paste for electronics assembly, all types of dispensers have traditionally relied on pneumatics to "push" the material out of the barrel reservoir. Unfortunately,... (Read More)
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste... (Read More)