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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging

From Epoxy Technology

This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.

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Thermosets and Thermoset Materials
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Resins and Compounds
Resins and compounds are used for shape fabrication or bond formation. Types include adhesive, casting, and leveling resins; caulk and grout; and sealants and thread lockers.
Casting Resins
Casting resins are pourable plastic or elastomer compounds that are used to cast parts, make molds, or form structures in place. They are mixed with a hardener, catalyst or activator and then poured into the sprue of open molds.
Polymers and Plastic Materials
Polymers and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials. They typically consist of thermoplastic or thermosetting resins in the form of pellets, powders or liquid resins. These materials can then be molded into a variety of shapes for a wide range of uses.
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Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. (read more)
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Topics of Interest

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive...

Epoxies are used in the packaging and assembly of three opto-electronic devices, including Fiber Optics, LEDs, and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The...

Tensile testing of thermal spray coatings is currently covered by a variety of internal company specifications and generally by ASTM C-633. It is a highly recognized fact that liquid epoxies, on...

Nitride ceramics are compounds of a metal or metalloid (Si, B) and nitrogen such as titanium nitride (TiN), silicon nitride (Si3N4), boron nitride (BN) or aluminum nitride (AlN). Nitrides are...

This paper discusses structural adhesives and the benefits they provide.