From Bare Board Group, Inc.
Blind and buried vias are needed when the circuit artwork or design is of a very tight or heavy packaging density that would not allow a via or vias to pass entirely through all the layers of the circuit board without interfering with another electrical feature.
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Topics of Interest
Chapter 21: INTRODUCTION TO HIGH-DENSITY INTERCONNECTION TECHNOLOGY Chapter 22: HIGH-DENSITY INTERCONNECT BUILD-UP TECHNOLOGIES Chapter 23: MICROVIA HOLE TECHNOLOGIES Happy T. Holden...
via or "feed-thru" hole connects the top circuitry of a printed circuit board to the bottom circuitry or any layer(s) in between. A via can be used as a test point when exposed or when a clearance or...
Test coupons are used as an indicator of quality - a tool for both the manufacturer and customer to help determine the quality of the manufacturing process and, hopefully, the quality of the finish...
The bare board is electrical tested to ensure that it reflects the original design as intended. The test is typically a series of continuity and isolations tests. There are basically two methods for...
Solder mask or solder resist is like varnish or lacquer that is applied to the outside or top and bottom layers to form a permanent protective coating for the copper traces of a printed circuit board.
