From SUSS MicroTec

In this paper, a revolutionary NIL technique, SCIL, and the corresponding tooling solution on SUSS mask aligners has been introduced. The imprints of 2D holes array over 6 inch area in sol-gel and AMONIL resist with soft PDMS stamp have been demonstrated. The structure depth and residual layer uniformity have been evaluated by measurements on the imprinted wafer. The capability of the UV enhanced SCIL process in AMONIL resist on different substrates has also been demonstrated. The unique consequently imprint principle and the composite stamp guarantee the conformal imprint and the compatibility for production atmosphere. This technique shows therefore great potential in high volume production of HB LED due to its excellent reliability.

Read the Whole Article

Products & Services
Semiconductor Wet Process Equipment
Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.

Product Announcements
SUSS MicroTec - MA/BA8 Gen3 - Innovative Imprint Lithography
The capabilities of the MA/BA8 Gen3 Mask Aligner can be optionally enhanced with various imprinting techniques for nanotechnology and UV-replication. (read more)
SUSS MicroTec - MJB4 Manual Mask Aligner
State-of-the Art R&D Solution for Small Substrates and Pieces Easy to use and compact in size the SUSS MicroTec MJB4 mask aligner represents the perfect system for laboratories and small volume... (read more)
SUSS MicroTec - MA100e Gen2
Dedicated Mask Aligner Solution for High Volume Production of Compound Semiconductors Devices With the MA100e Gen2 SUSS MicroTec has designed a dedicated mask aligner platform for processing... (read more)
SUSS MicroTec - MA300 Gen2 Automated Mask Aligners
The second generation of the SUSS MicroTec MA300 Gen2 is a highly automated mask aligner platform for 300mm and 200mm wafers. It is specifically designed for 3D Packaging, wafer bumping and wafer... (read more)
SUSS MicroTec - MA200Compact Mask Aligner
Combining High Resolution with High Throughput and Submicron Precision... (read more)
SUSS MicroTec - LithoPack300 Cluster
Lithography Cluster for Wafer Level Packaging The LithoPack300 (LP300) lithography cluster consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LP300 is specifically... (read more)
SUSS MicroTec - Delta AltaSpray Spray Coater for High Topographies
SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D micro-structures. (read more)
SUSS MicroTec - MO Exposure Optics
Next Generation Illumination System for SUSS MicroTec Mask Aligners The MO Exposure Optics provides more light, improved uniformity and customized illumination shaping to further optimize the... (read more)
SUSS MicroTec - Delta 12RC
Universal Coating System for Wafers up to 300mm The Delta 12RC is the ideal platform for manual and semi-automated spin coating processes in R&D and low-volume fabrication. Substrates up to 300mm... (read more)
 

Topics of Interest

Karen Petrillo and Kaushal Patel, ; and Mark Slezak and Gary Dabbagh, The use of immersion lithography as a technique to enhance resolution and depth of focus was described as early as 1987, but it...

8.6 DFB Laser Based on Sol-Gel Derived Organic-Inorganic Hybrid Thin Film Waveguides Wave Division Multiplex (WDM) technique is widely used in modern optical communication network and integrated...

3.1 Basic Microtechniques This section aims to provide the readers an overview of basic microtechniques, which are not only used for microfluidics but also for microelectronics and MEMS. Refer to...

M. M. Alkaisi, MacDiarmid Institute of Advanced Materials and Nanotechnology, University of Canterbury New Zealand R. J. Blaikie, MacDiarmid Institute of Advanced Materials and...

Plasma pre-treatment for low-temperature direct wafer bonding is used worldwide in many different applications. In this process the full wafer surface is exposed to the plasma. Recently, a new process...