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From California Eastern Laboratories
Feb. 27, 2008 - Perusing a recent report from the TECHCET Group about materials needed to form interconnects for 65nm-32nm node ICs, the only major change on the horizon is the use of pores or air-gaps in the dielectric material to get to ultra/extreme low-k. Meanwhile, carbon nanotubes and self-assembled dielectrics will almost certainly not be used as commercial IC interconnects in manufacturing anytime soon. Feb. 26, 2008 - Plenary talks at this week's SPIE Advanced Lithography Conference reviewed the road ahead for lithography, from how far 193nm immersion can be pushed (probably 32nm, helped double patterning, new lens materials/fluids, and 3D) to the projected readiness of an EUV infrastructure (maybe by 2010-2012), and the progress and stalls in ongoing work to achieve success in both areas. Products & Services
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Optical interconnects are flexible jumpers used to interface or connect with integrated circuits (ICs), or circuits in general.
Specialty or proprietary products and accessories related to electrical connectors and interconnects.
Projectors receive data from a computer or video source and project this data onto a screen via internal light sources, power sources and converters.
Tableting presses are used for uniaxial pressing of powdered materials into shaped tablets or compacts - usually at high speeds.
Product Announcements
Topics of Interest
As silicon LSI devices continue to be scaled down in sire, the patterning process of resists on Si wafers is becoming more critical. For Si LSI, a reliable lithographic technology is needed to define...
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The quality of optical components used in complex applications such as lasers, microscopes, and lithography systems, is critically influenced by surface morphology. The majority of these components –...
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Overall, the members of Environmental Protection’s 2008 Environmental Roundtable expect economic advances in the environmental industry, especially in the water treatment and air pollution control...
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Conductive coatings consist of a metallized layer deposited through thin film (evaporation or sputtering), plating, or thermal spray processes. They are applied to enclosures that house electronic...
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The sixth Materials Congress will take place in Grantham on 13-15 May 2008, addressing "Materials for the Future" through a series of technical symposia, plenary lectures and industry masterclasses.
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Technical Articles
JEDEC Solid State Technology Association
- Professional Organizations
Solid State Technology
- Journals & Periodicals
Rotary Vs. Solid State Design
- Data Acquisition and Signal Conditioning
Solid State Design Considerations
- Data Acquisition and Signal Conditioning
Better Process Protection with Automated Gas Monitoring/ Purification
- Gas Handling Equipment
Mobile Radio Technology (MRT)
- Journals & Periodicals
Rotor Stator Mixer Design Shifts Into High Gear
- Materials Processing Equipment
Solving Old Problems with New Technologies
- Industrial Tools
CleanRooms
- Journals & Periodicals
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