Ioannis Doltsinis
Faculty of Aerospace Engineering, University of Stuttgart, Germany
1. Introduction
The present study deals with aspects of brittle and quasi-brittle failure of brittle...
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By the time a printed circuit board is ready for the final manual soldering of its
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9.1 INTRODUCTION
Most composites are subject to variable mechanical and environmental conditions during fabrication, storage and service. Residual stresses (discussed in Sections 3.10, 7.3 and 8.7)...