Sites:
Home > Technical Library > Materials and Chemicals > Electrical, Optical, and Specialty Materials > Understanding Mechanical Properties of Epoxies for Modeling, Finite Element Analysis (FEA)

Understanding Mechanical Properties of Epoxies for Modeling, Finite Element Analysis (FEA)

From Epoxy Technology

The unique molecular structure of epoxy allows for a large variety of mechanical properties through varying formulations.

Read the Whole Article
Products & Services
Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Electrical Insulation and Dielectric Materials
Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Product Announcements
Epoxy Technology - Tech Tip 19 - Mechanical Properties of Epoxies
The unique molecular structure of epoxy allows for a large variety of mechanical properties through varying formulations. Epoxies can range from very soft and flexible to very hard and rigid. Softer... (read more)
IMET Corporation - mechanical design solutions for your new product
3D CAD Modeling Parts Drawings Mechanism Design Discrete Component Design FEA/Structural, Vibrational, Thermal Analysis GD&T Analysis Engineering Documentation DFM Assessment... (read more)
Composites Group (The) - Product Engineering
Thermoset molding compounds like SMC, BMC and TMC are not widely understood in many industries. Engineers accustomed to designing in metals, castings and thermoplastics are not as familiar with... (read more)
IMET Corporation - FEA/Structural, Vibrational & Thermal Analysis
IMET Capabilities include: 3D CAD Modeling Parts Drawings Mechanism Design Discrete Component Design FEA/Structural, Vibrational, Thermal Analysis GD&T Analysis Engineering... (read more)
IMET Corporation - Optimized Mechanical Design!
IMET Capabilities include: • 3D CAD Modeling • Parts Drawings • Mechanism Design • Discrete Component Design • FEA/Structural, Vibrational, Thermal Analysis •... (read more)
IMET Corporation - Component Configuration Assessment
Design Constraints Assessment Concept Development Ergonomic Research Component Configuration Assessment Form Study Mockup... (read more)
IMET Corporation - Form Study Mockup
Design Constraints Assessment Concept Development Ergonomic Research Component Configuration Assessment Form Study Mockup... (read more)
 
Topics of Interest

Photo modeling technology has progressed to the point where a dimensionally accurate 3D model can be economically constructed from a series of digital photographs of a structure. In this paper, we...

The most accurate finite-element analysis today models multiple physical properties interactively. Soon after computers entered the technology landscape, finiteelement analysis (FEA) emerged as a...

2.6 EPOXIES Epoxy resins form the basis for a wide variety of polymer materials used in electronics ranging from conformal coatings to adhesives, encapsulants, and printed wiring board laminates.

Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the...

1.1 INTRODUCTION Epoxy adhesives are chemical compounds used to join components by providing a bond between two surfaces. Epoxy adhesives were introduced commercially in 1946 and have wide...