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How to Reduce Voiding in Components with Large Pads

From Indium Corporation

As the electronics industry moves toward
miniaturization and multifunction,
smaller components with more functions,
such as quad-flat no-leads (QFNs) and
LGAs, are increasingly used in a variety
of products.
QFNs, being a near chip-scale package,
have perimeter contacts on the package
bottom providing electrical connections
to the PCB. An exposed large area
thermal pad, located on the center of the
bottom, improves heat transfer out of the
chip. QFNs have been increasingly used
in the electronics industry, because they:
show no visible lead protruding from
the bottom; possess a smaller footprint
and smaller profile than that of QFPs;
and they provide excellent electrical and
thermal performance.

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