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Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations

From Arlon LLC

Simple composits of silicone rubber, extending filler, and fiberglass offer an attractive combination of thermal, physical, and electric properties that make these materials an ideal choice for use as thermal interface materials. Good dielectric strength and low thermal impedance that is relatively stable from 8 to 200 psi of pressure offer excellent performance in pad applications such as transistor to heatsink mounting. The addition of high shear strength and low shear modulus offer excellent performance in adhesive applications such as photovoltaic to heatsink mounting where performance is demanded for 30 years or more. Transistor and photovoltaic applications are discussed and two new silicone thermal interface materials for use as pad or adhesives are present and compared to current offsets.

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Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
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Topics of Interest

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