From Skyworks Solutions, Inc.
Due to their small size, beam-lead devices are fragile and should
be handled with extreme care. The individual plastic packages
should be handled and opened carefully, so that no undue
mechanical strain is applied to the packaged device. It is recommended
that the beam-lead devices be handled through use of a
vacuum pencil using an appropriate size vacuum needle or a
pointed wooden stick such as a sharpened Q-tip or match stick.
The device will adhere to the point and can easily be removed
from the container and positioned accurately for bonding without
damage. Such handling should be done under a binocular microscope
with magnification in the range of 20X to 30X.
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