From Silicon Labs
Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontrollers (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows the product designer to significantly reduce the size of the electronic circuit. High-volume products such as hearing aids, cell phones and RFID cards have become more comfortable, more portable and thinner due to the integration of die in the circuit design. Until recently, lower volume products have not benefitted from the same level of innovation as it has been historically difficult to procure reasonably priced die in low volumes.
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Topics of Interest
D DEFECT An anomaly that is in non-conformance with normally accepted characteristics. DEFINITION The sharpness of a deposited pattern, or the exactness with which a feature is patterned with respect...
K KIRKENDALL EFFECT The occurrence of void formation in a material caused by diffusion of atoms across an interface the result of exposure to elevated temperature. Excessive voiding can result in an...
Overview An active electronic component is a circuit component that requires external power to perform its function. The discussion of active components in this section is limited to discrete diodes,...
Advances in digital signal processors and microcontrollers have increased the opportunities for integrating this technology into medical electronics. Digital technology has made big strides this past...
Cymbet™ EnerChip™ thin film, solid state batteries feature all solid state construction, are packaged in standard integrated circuit packages, and can be reflow soldered for high volume...
