Sites:
Home > Technical Library > Materials and Chemicals > Electrical, Optical, and Specialty Materials > Epoxy and Silicone Interactions

Epoxy and Silicone Interactions

From Epoxy Technology

Epoxy adhesives are a great choice for many applications for their excellent adhesion,
chemical and temperature resistance, as well as many other attributes. When selecting an epoxy for a specific application, it is important to consider any potential negative
interactions from alternative chemistries that may be used within the same design.

Read the Whole Article
Products & Services
Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Electrical Insulation and Dielectric Materials
Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Product Announcements
Master Bond, Inc. - Optically Clear Epoxy for Fiber Optic Bonding
Master Bond EP30-1 is an optically clear epoxy designed for high performance fiber optics bonding, coating, and potting applications. This low viscosity, two part epoxy cures at room temperature or... (read more)
General Digital Corporation - Optical Bonding of Flat Panel Displays
Improves a display's optical performance and durability, as well as its ability to resist the detrimental effects of shock, vibration and moisture. (read more)
Master Bond, Inc. - Fast Cure Medical Adhesive to the Rescue
Master Bond EP3HTMED is a fast curing medical adhesive designed to improve the assembly of disposable and reusable medical devices. High strength bonds are resistant to impact, vibration and stress... (read more)
ELANTAS PDG, Inc. - Battery Sealants
Batteries are a common power source for many household and industrial applications. Independent of end use application, all batteries need adequate sealing to prevent leaks, ensuring safe and... (read more)
Sherwin-Williams Protective & Marine Coatings - Fast Clad® ER Epoxy
Sherwin-Williams Industrial and Marine Coatings Fast Clad ER® Epoxy Pipeline Coating provides improved edge retention and a faster cure time than conventional epoxies and allows pipeline coating... (read more)
Epoxy Technology - EPO-TEK® UV Cure Selector Guide
Epoxy Technology, Inc. offers a complete line of high performance Ultraviolet (UV) cure adhesives ranging in viscosity, flexibility, refractive index and light transmission. (read more)
RS Industrial, Inc. - Adhesion Science Structural Adhesives
A structural adhesive bond can be formed with a variety of polymer types, depending on the required end use. The common characteristic of all structural adhesives is that they are applied as a liquid... (read more)
Master Bond, Inc. - Looking for An Electrically Conductive Adhesive?
Master Bond EP79 is your answer to a cost effective alternative to silver filled epoxies. Its silver coated, nickel filler translates into exceptionally low electrical resistance. Combine that with... (read more)
Topics of Interest

Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the...

16.1 INTRODUCTION This chapter identifies and discusses various epoxy adhesives and the processes that have been used to successfully bond or seal specific substrates. There are only a few materials...

1.1 INTRODUCTION Epoxy adhesives are chemical compounds used to join components by providing a bond between two surfaces. Epoxy adhesives were introduced commercially in 1946 and have wide...

2.1 INTRODUCTION Proper formulation of epoxy adhesives requires knowledge of the chemical reactions that lead to polymerization as well as the chemical and physical properties of both the uncured...

6.1 Introduction This chapter describes the adhesives for specific adherend types. Tables are occasionally published listing large numbers of adhesive types recommended for specific adherends. Such...