From Interplex Industries, Inc.
Combining the special advantages of both highly-automated SMT processing and proven solder-free
press-fit technologies enables creation of cost-effective, production-ready solutions for streamlining
the overall design and production of mother-board/daughter-board assemblies.
After being fully assembled and tested, the mother-board can now be mated up to the daughter-board
without any exposure to additional heat cycles because the daughter card has a press-fit interconnect
on the SMT card edge connector. Compliant press-fit technology provides a highly reliable method for
interconnecting the daughter-board(s) that is completely solderless and eliminates labor-intensive
secondary operations or special handling.
As outlined in this Tech Bulletin series, the fundamental key to success for integrating these two
technologies is to leverage best-practice disciplines on the SMT and the Press-Fit ends of the
interconnect and to maximize the mechanical, electrical and manufacturability aspects of both.
The bottom line is a reliable and highly adaptable solution that cost-effectively meets the industry's
evolving requirements for design-friendly and automation-ready integration of multi-board assemblies.
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Topics of Interest
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