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SMT Card-Edge Solutions: Part 1: Application Requirements

From Interplex Industries, Inc.

Combining the advantages of highly-automated SMT processing and proven solderfree press-fit technologies now offers a cost-effective solution to the growing needs for efficient, design-friendly and automation-ready integration of multi-board assemblies.
The next Tech Bulletin in this series will provide details on the important specifications and design issues involved with maximizing these SMT Card-Edge Press-Fit solutions for optimal assembly efficiency, product design flexibility and ongoing reliability.
Topics addressed in the next Tech Bulletin include:
? Leveraging through-hole SMD for mechanical strength
? Optimizing SMT solder flow and joint formation
? Using high-conductivity material for up to 15 Amps per contact
? Operating temperatures, contact resistance and retention

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Products & Services
Electrical and Electromechanical Assembly Services
Electrical and electromechanical assembly services provide board-level assembly, chassis and rack panel wiring, and front panel assembly. Typically, suppliers provide the complete turnkey production of electronic and electromechanical finished products from procurement through final assembly with testing and burn-in, if required.
Electronic Manufacturing Services (EMS)
Electronic manufacturing services (EMS) are companies that design, assemble, produce, and test electronic components and PCB assemblies for original equipment manufacturers (OEMs).
Product Announcements
Interplex Industries, Inc. - Why Press-Fit for Card-Edge Connections?
Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in... (read more)
Interplex Industries, Inc. - A Solderless Card-Edge Connector System
Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in... (read more)
Interplex Industries, Inc. - What are Best Practices for Press-Fit Suppliers?
With a rapidly expanding range of industries now relying on solder-free Press-Fit technology as a key lynchpin in their electronics assembly strategies, it has become increasingly important for... (read more)
Interplex Industries, Inc. - Getting Results with Press-Fit Technology
As discussed in previous Tech Bulletins, Press-Fit technology offers an excellent alternative for creating reliable electro-mechanical interconnects without using solder. To achieve the best results,... (read more)
Interplex Industries, Inc. - Press-Fit Tech Bulletin:
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Interplex Industries, Inc. - Learn How the "Claw" Edge Clip Design Works
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Interplex Industries, Inc. - High-Power Press-Fit Current Capacity: A Study
This Interplex Press-Fit Tech Bulletin discusses the current carrying capacity for Press-Fit applications, especially in high-power applications. The specific three topics in this series are:... (read more)
Molex - ZXP® zSFP+™ Interconnect System
Molex Incorporated has been declared the winner of The Most Competitive Connector Product in China in 2012 Award, one of the six award categories in the China Electronic Market 2012 Editor's Choice... (read more)
Advanced Interconnections Corp. - SMT Connectors- Mezza-pede Low Profile, 1mm pitch
Mezza-pede® low profile 1mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. (read more)
Interplex Industries, Inc. - A Solderless Solution for Power Applications
Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative... (read more)
Topics of Interest

Combining the special advantages of both highly-automated SMT processing and proven solder-free press-fit technologies enables creation of cost-effective, production-ready solutions for streamlining...

The bottom line is that press-fit zone interconnects are now capable of providing significantly higher current carrying capacities than previously assumed and can deliver reliable operating current...

The bottom line is that press-fit technology has matured into a powerful solution for eliminating solder, avoiding complex secondary production processes, improving reliability and reducing costs.

As discussed in previous Tech Bulletins, the explosive growth of automotive electrical systems and other industries using inverter and converter based power modules is driving the need for press-fit...

Overview The miniaturization of circuit boards and cards, made possible with higher-density integrated circuits and surface-mount technology (SMT), has been an ongoing trend in electronic packaging.