LPCC2x2 Package - App Note

Avago's LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat dissipation path. This also reduces the package leads' inductance. In addition, a pair of exposed tie bars enables visual and electrical confirmation of the solder joint between the die-attach paddle and the PCB. This package has a half notch located at the bottom of the package to indicate pin 1 (Figure 1). All these features are packed in an attractively small package size of 2 mm (W) X 2 mm (L) x 0.75 mm (T) that passed the most stringent EIA/JEDEC moisture sensitivity level 1 (MSL1) lead free profile. This application note provides guidelines to PCB land pattern layout, stencil design, and manual soldering and rework for the LPCC2x2 in order to achieve optimum RF performance and a highly reliable product.