Go to GlobalSpec.com Home
Toolbar   The Engineering Toolbar
The Ultimate Resource for Engineering and Technical Research. (Learn More)

Achieving Interconnection with Pulse-Heated Bonding

From Miyachi Unitek Corporation
 

 

The process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils is referred to as heat sealing. The essential characteristics of this process are heating and cooling of the adhesive under pressure.

Anisotropic conductive adhesives contain small conductive particles that, when compressed and heated, form an electrical interconnection between parts. The adhesives are widely used to connect the electrically conductive areas on a liquid crystal display (LCD) to a PCB via a flexible circuit with conductive tracks. Another common application is the electrical interconnection of two flex circuits.

Product Announcements
STACI - Printed Circuit Boards Experts
STACI Corporation's PCBs are used widely throughout the electronics industry. Common applications include telecommunications, automotive, computer networks, consumer electronics, industrial controls,... (read more)
Protavic America, Inc. - New generation of polymer termination products
Protavic's new generation of polymer termination products offer improved flexibility and cosmetics. The BCE-30375M offer the latest in NME & BME termination technology. (read more)
Device Technologies, Inc. - Conductive Foam Cushion
Conductive EMI cushions are constructed from a wide combination of conductive foam, conductive fabric and conductive pressure-sensitive adhesive tape. The foam is plated with Copper/Nickel or Silver... (read more)
Miyachi Unitek Corporation - Bonding in an Array
Miyachi Unitek's new Desktop Hot Bar Bonding System is ideally suited for applications which require hot bar bonding multiple parts in an array at one time. (read more)
Can-Do National Tape - 3M RITE-LOK™
RITE-LOK™ industrial adhesives and sealants are a new and exciting addition to the 3M adhesives portfolio. The products are widely used by original equipment manufacturers (OEMs) and the... (read more)
Master Bond, Inc. - Two Part Epoxy Offers Improved Thermal Management
Master Bond's EP30BN two part boron nitride epoxy is a thermal adhesive used for bonding, sealing and potting, designed to optimize heat dissipation of aerospace, defense and microelectronic... (read more)
Advanced Input Systems - Flex Circuits
Flex circuits offer OEM customers several options because they have trace routing, current carrying capabilities, and SMT component populating options of a FR4 printed circuit board; and flexibility... (read more)
General Digital Optical Bonding Laboratories - Optical Bonding
Optically bonding will improve your flat panel display's optical performance, as well as increase its ability to withstand impact. (read more)
Topics of Interest
Certain acrylic formulations are easily converted to UV or light curing formulations with the addition of photoinitiators to activate the free radical cross-linking mechanism. These single component... (Read More)
Virtually every electronic circuit built nowadays uses a printed circuit board (pcb) as both its interconnecting medium and mechanical mounting substrate. The pcb is custom-designed for the circuit it... (Read More)
An adhesive can be defined as a substance that is capable of holding materials together by surface attachment. Surfaces on which an adhesive is applied are known as adherends, while the process of... (Read More)
Thermoplastic resins provide a class of adhesives that can cure without chemical reaction. They can be repeatedly melted and solidified without greatly hindering their properties and are therefore... (Read More)
The process of connecting two or more conductive objects together by means of a conductor so that they are at the same electrical potential, but not necessarily at the same potential as the earth. The... (Read More)