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Ball Grid Array (BGA)

 

 

Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as bismaleimide triazine (BT). As a rule, BGA traces are designed to minimize crosstalk and potential problems with line speed. Ball-grid array (BGA) packages are also designed to meet the electrical and thermal demands of high-speed and high-power ICs. BGA provides lower ground or power inductance by assigning ground or power nets via a shorter current path to the printed circuit board (PCB). Thermally-enhanced mechanisms (e.g., heat sinks, thermal balls) may be applied to BGA packages to reduce thermal resistance.

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IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn more about IC Sockets and Interconnect Components
Microcontrollers (MCU) are complete computer systems on a chip. They combine an arithmetic logic unit (ALU), memory, timer/counters, serial port, input/output (I/O) ports and a clock oscillator. Search by Specification | Learn more about Microcontrollers (MCU)
Memory chips are internal storage areas in computers. Although the term “memory chip” commonly refers to a computer's random access memory (RAM), this product area includes many different types of electronic data storage. Computer memory stores data electronically in cells. Without memory chips, a computer could not read programs or retain data. Search by Specification | Learn more about Memory Chips
Complex programmable logic devices (CPLDs) are integrated circuits (ICs) or chips that application designers configure to implement digital hardware such as mobile phones. CPLDs can handle significantly larger designs than simple programmable logic devices (SPLDs), but provide less logic than field programmable gate arrays (FPGAs). Search by Specification | Learn more about Complex Programmable Logic Devices (CPLD)
Dynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information. Search by Specification | Learn more about DRAM Memory Chips
Product Announcements
Coto Technology - BGA Reed Relays Provide Superior RF Performance
Coto Technology, of Providence, RI, has announced the release of two patented ball-grid-array (BGA) Reed Relays. The B10 and B40 BGA relays utilize breakthrough patented technology to provide leadless... (read more)
Computrol Inc. - Electronics Manufacturing
Computrol focuses on providing electronic manufacturing services throughout the life cycle of high-mix products. Maintaining this focus enables them to provide faster assembly operations than those in... (read more)
Computrol Inc. - Electronic Manufacturing
Computrol knows how to employ technologies that meet individual company goals. Advanced electronic contract manufacturing capabilities using leading-edge packaging like Micro Ball Grid Array (BGA) and... (read more)
Computrol Inc. - World-Class mid to low volume, high mix EMS
Computrol is a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to original equipment manufacturers. Utilizing state-of-the-art manufacturing equipment and... (read more)
OK International, Inc. - APR-5000 Series Array Package Rework Systems
Rework Systems (BGA Rework Systems) that incorporate state-of-the-art vision, and closed-loop time, temperature and airflow control. (read more)
Cal Quality Electronics, Inc. - High Mix Electronics Manufacturing Services
Cal Quality Electronics is a true full-service, turn-key electronics manufacturer. High quality, dependable delivery and responsive service are part of every job from start to finish. (read more)
Topics of Interest
The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad... (Read More)
Table C-1: A List of Package Abbreviations Abbreviation Full name BDIP (SDIP) Butt-mounted dual inline package (surface DIP, std pitch) BGA Ball grid... (Read More)
Prefix Index Search On: Topics to search on within the Manufacturer web page XAPP: Xilinx Application Note AN: Application Note CP: Conference Paper WP: White Paper TechXclusives: Xilinx... (Read More)
A AC alternating current ADC analogue-to-digital converter ALU arithmetic and logic unit AM amplitude modulation AMD advanced micro devices... (Read More)
3DES Triple Data Encryption Standard A/D Analog-to-Digital Converter ABEL Advanced Boolean Expression Language ADC Analog-to-Digital... (Read More)
See more product announcements for IC Sockets and Interconnect Components
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TP-101 Series PC Mount Test Point Jumpers

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