Semiconductor, microelectronic, and IC package testing includes testing at the wafer, die, or packaged IC level. Semiconductor and IC package testing services may provide wafer sort and packaging services in addition to component evaluation. In the packaging process, fabricated wafers are cut into dies and then "packaged" in a lead frame or other system, which protects the chip and allows interconnection to the electronic circuit on the PCB, module, or product. Wafer sort is wafer-level testing where the individual dies are tested for defects and then marked before the packaging process. Defective dies are rejected, which avoids unnecessary packaging costs. After the packaging and interconnect is complete, the packaged device may be put through additional functional or burn-in testing, often using automated test equipment (ATE).
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