Structure or residual stress instruments are capable of discerning microstructural, chemical bond type, or structural features of wafer or thin film deposits. Microstructural features include phase distribution, grain size or texture (grain orientation). Structural features include crystal structure, crystal orientation, degree of slip or twinning and stacking faults. Structural or residual stress instruments used to measure the stress in thin films or substrates. The stress develops in a film or substrate due to the volume and thermal changes during the deposition process. Residual surface stresses develop in the surfaces or wafers or other substrates due to cutting or abrasion processes. X-ray diffraction techniques are commonly used to quantify residual stresses and structure. The measurement of bowing or wafer shape can also provide an indication of film or residual stress.