From Complete PCB Design Using OrCad Capture and Layout
ANSI B94.11-197 (see also ASME B94.1 IM-1993), Twist Drills
ANSI Y32.2-1975 (see also IEEE Std 315-1975), Graphic Symbols for Electrical and Electronics Diagrams
B18.2.8 1999, Clearance Holes for Bolts, Screws, and Studs
B18.6.3 2003, Machine Screws and Machine Screw Nuts
ASA 618.11-1961, Miniature Screws
Y 14.5M, Dimensioning and Tolerancing
ASME B94.1 IM-1993, Twist Drills
IEEE Std 315-1975 (ANSI Y32.2-1975), Graphic Symbols for Electrical and Electronics Diagrams
IPC-1902/IEC 60097, Grid Systems for Printed Circuits
IPC-2141, Controlled Impedance Circuit Boards and High-Speed Logic Design
IPC-2221A, Generic Standard on Printed Board Design
IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards
IPC-2223A, Sectional Design Standard for Flexible Printed Boards
IPC-2224, Sectional Standard for Design of PWBs for PC Cards
IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-2226, Sectional Design Standard for High-Density Interconnect (HDI) Printed Boards
IPC-2251, Design Guide for the Packaging of High-Speed Electronic Circuits
IPC-2515A, Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description [BDTST]
IPC-2615, Printed Board Dimensions and Tolerances
IPC-4101A, Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-7351, Generic Requirements for Surface-Mount Design and Land Pattern Standard
IPC-9252, Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-A-600G, Acceptability of Printed Boards
IPC-A-610, Acceptability of Electronic Assemblies
IPC-HDBK-610, Handbook and Guide to IPC-A-610
IPC-CM-770E, Guidelines for Printed Board Component Mounting
IPC-D-322, Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
IPC-D-350, Printed Board Description in Digital Form
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Topics of Interest
Table C-1: A List of Package Abbreviations Abbreviation Full name BDIP (SDIP) Butt-mounted dual inline package (surface DIP, std pitch) BGA Ball grid array BQFP Bumper quad flat package CBGA Ceramic...
Chapter List Appendix A: List of Design Standards Appendix B: Partial List of Packages and Footprints and Some of the Footprints Included in OrCAD Layout Appendix C: Rise and Fall Times for Various...
REFERENCES Capture User's Guide. IPC-2221A. Generic Standard on Printed Board Design. IPC/Association Connecting Electronic Industries, Northbrook, IL, May, 2003. Ott, Henry W. Noise Reduction...
Component Package Types and Mounting (SMD) IPC-7351, Section 8.0, pp. 44 70. IPC-D-330, Section 5. (see also Land Patterns) Component Placement, Spacing, and Orientation General considerations...
Chapter 48: ACCEPTABILITY OF FABRICATED BOARDS Chapter 49: ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES Chapter 50: ASSEMBLY INSPECTION Chapter 51: DESIGN FOR TESTING Chapter 52: LOADED BOARD...