From MEMS Packaging
T.R.Hsu and J.S.Custer
1.1 CHAPTER SCOPE
This chapter intends to set the tone for several subsequent chapters in the book. It begins with an overview of MEMS and microsystems and their representative products that are available in the current marketplace. The authors offer their views on why the packaging and assembly of these products have become major cost factors in the production of MEMS and microsystems. Major challenging issues related to MEMS and microsystems packaging will be outlined. In the authors view, research institutions and industries have not effectively dealt with some of these issues, such as assembly tolerances and product testing. A generic packaging process flow is offered to provide readers with a perspective on the extent of the tasks involved in this important stage of production.
1.2 MEMS AND MICROSYSTEMS
The term MEMS is an abbreviation of microelectromechanical system. Any human-made device that contains parts or components of size ranging from 1 m to 1 mm that perform an engineering function or functions by electromechanical means is classified as MEMS .
Microsystems involve MEMS, which include micro sensors, actuators of all kinds, and the auxiliary integrated circuits for device function controls and signal transductions, conditioning and processing, function control systems, etc. Microsystems are expected to perform complex engineering functions, which may not necessarily be limited to those of an electromechanical nature. Typical MEMS and microsystems products are presented in this chapter .
1.2.1 Commercially available MEMS
Acoustic wave sensors for sensing chemicals.
Biomedical sensors for sensing...
Products & Services
Topics of Interest
T.R.Hsu and J.Clatterbaugh 2.1 CHAPTER SCOPE This chapter presents the working principles of both surface and wire bonding techniques that are essential to MEMS and microsystems packaging. Special...
Dr. Rajeshuni Ramesham Jet Propulsion Laboratory/ California Institute of Technology Dr. Reza Ghaffarian Jet Propulsion Laboratory/ California Institute of Technology Prof. Farrokh Ayazi Georgia...
G. K. Ananthasuresh, Ph.D. Assistant Professor of Mechanical Engineering and Applied Mechanics University of Pennsylvania, Philadelphia, Pa. 15.1 SCOPE OF THE CHAPTER Even though the word mechanical...
There's a big future in small things, according to Helmut Detter, head of the department of precision mechanics at the Technical University of Vienna. As one of the coordinators of the Micro Moulding...
J.S.Custer, A.D.Oliver and M.V.Collins 4.1 CHAPTER SCOPE The goal of packaging is to combine MEMS and other components into a product suitable for being used, either in the next level of assembly or...