Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating

Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation, glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable electronic component to protect it from environmental and mechanical damage. Low CTE epoxies fit these rolls very well as the amount they expand or contract when exposed to different environments is minimal. Until now, many of the commercially available low CTE epoxies were made up of two components, the resin and the catalyst (hardener). Epoxies, Etc... has developed a unique low CTE Ultraviolet Curable Epoxy that has many benefits over its two component counterparts.