Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology

The Potting or Encapsulation of electronic components is a common engineering design tool to protect products from environmental exposure. Potting involves the covering or embedding of an electronic or electrical device. In most cases an assembly is placed in a case or shell and then a liquid potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating are often used interchangeably and we will refer to both processes as Potting in this paper. The main purpose of the Potting Compound is usually to protect an electronic assembly from moisture, chemicals, dirt or other contaminants. The Potting Compound may also provide other properties such as heat dissipation, flame retardency, or vibration resistance. Epoxies, Etc... located in Cranston, RI USA, has designed new Ultraviolet (UV) Curing materials that offer many advantages over two component systems. These products are also different than most common UV