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From taconic-add.com
With PTFE’s low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever- increasingly-competitive market. The RF Microwave Laminate industry has responded in recent years by for example using thermosetting plastics along with combined inorganic (ceramic) fillers. This paper describes a ceramic-filled PTFE laminate which was developed to meet the challenge of the commercial RF Microwave industry requirements. Products & Services
RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Caulk, grout and joint compounds are used to fill joints, level surfaces and seal or repair cracks.
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
RF and microwave connectors are used to connect the ends of cables in systems that operate in the radio frequency (RF) or microwave spectrum. They include threaded or bayonet-style couplings that snap, screw, or push into place.
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Topics of Interest
With PTFE’s low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF...
(Read More)
The reasons for selecting circuit board are threefold. First, to allow the integration of digital and Radio Frequency (RF) circuitry into a single assembly. Second, to decrease overall printed circuit...
(Read More)
Taconic ADD publishes technical articles in trade magazines and presents technical papers at microwave conferences. We also receive technical articles from our customers and leading OEMs. We would...
(Read More)
In developing a new product line of high volume commercial plastic packaged GaAs monolithic devices, it has become evident that normal design, fabrication, and evaluation techniques no longer apply.
(Read More)
This application note describes the design of a Federal Communications Commission (FCC) compliant board layout to give new radio frequency (RF) designers a head start using rfPIC transmitters such as...
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Technical Articles
How PTFE Can Compete With The Best In Thermosets (.pdf)
- Surface Coating and Protection
Multilayer Lamination Methods for PTFE-Based PCBs (.pdf)
- Surface Coating and Protection
The Anisotropy of Dielectric Constant in TLY-5A Material (.pdf)
- Surface Coating and Protection
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