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From ors-labs.com
This paper presents a case history of a failure analysis performed on hybrid devices that exhibited electrical failures during thermal cycle with bias. Electrical testing revealed resistive shorts between Vcc and ground bond pads on integrated circuits within the package. A dendritic growth containing gold and copper extended from Vcc to ground across the surface of the passivation. Crystalline-like corrosion products were observed on the bond pads. The failure mechanism is shown to be an electrochemical corrosion reaction within the hybrid.
Hybrid devices can contain reactive chemical species from outgassing organic adhesives, residual cleaning solvents, and other process related materials. These are present as absorbed species and as gases within the package cavity. The constituents in the package ambient can react with the surfaces of wire bonds, bond pads, and substrate metallization to form the dendritic growth and other corrosion products.
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