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From ors-labs.com
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film used to mount the wafer during the die sawing operation. The analytical equipment and methodology used to determine the failure mechanism are described. Auger Electron Spectroscopy and X-ray Photoelectron spectroscopy are used to identify the elements and their chemical states on the die bonding surfaces. The wafer mounting film is analyzed by Fourier Transform Infrared Spectroscopy. A process related failure in conductive die attach systems is described and corrective actions are presented. This analytical approach can be extended to other epoxy attach materials systems.
Products & Services
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
Adhesive tapes and films temporarily or permanently join materials together.
Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials.
Specialty or proprietary products and accessories related to spectrometers.
Cloth tapes use a woven or nonwoven fabric backing that provides a high-strength material compared to film or paper tapes.
Topics of Interest
The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise...
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The subject of this paper is the failure analysis on several hybrid devices submitted to Oneida Research Services, Inc. (ORS). The analysis was initiated because of electrical testing failures -- a...
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Traditionally, the most common types of die attach materials used in the semiconductor industry have been solder or adhesive. Both have been applied to the substrate, immediately before die attach.
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Thin plastic packages, such as TQFPs, are more sensitive to stress and warpage. As a result, warpage in TQFPs may lead to severe delamination or die cracking. The assembly process and the choice of...
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This paper presents a case history of a failure analysis performed on hybrid devices that exhibited electrical failures during thermal cycle with bias. Electrical testing revealed resistive shorts...
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