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Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules
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From Delphi
In many applications, especially automotive, solder interconnects experience degradation due to prolonged temperature and power cycling. This degradation behavior manifests itself as changes in the grain/phase structure, primarily through grain/phase coarsening. Because the magnitude of the change in grain/phase structure is strongly dependent upon the environmental stresses, quantifying microstructural changes provides an alternative approach to calculating an acceleration transform number or function. Products & Services
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