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Topics of Interest
In the section of this book dealing with input stages I have gone to some lengths to demonstrate that a plain unassisted amplifier if designed with care can provide DC offset voltages at the output...
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The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond...
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2.1 Linear Passive Time-Invariant Networks
This book is concerned with the design of passive RF and microwave filters. These devices are manufactured using a variety of technologies, e.g. coaxial...
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Section 6-2: Buffer Amplifiers and Driving Capacitive Loads
Walt Jung, Walt Kester
Buffer Amplifiers
In the early days of high speed circuits, simple emitter followers were often used as high...
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BARE-BONES SPECTRUM ANALYZER
While an ac voltmeter can provide an indication of the field strength to which a probe is
exposed, it does not provide any indication of the spectral contents of an...
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