With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space. Where technique comes in is choosing where and for how long to apply that light along with the application of accessory equipment to optimize solder paste reflow. This presentation covers the specifics of how to determine which process choices are the right process choices based on the needs of your product to maximize yield and throughput. The first requirement is finding a method to present or fixture the product to best facilitate both dispensing of solder paste and delivery of laser light. For the most consistent solder paste dispensing, each part needs to be located with the same relative position to the dispense tip in the Z axis. The distance from the bottom of the dispense tip needs to be between 1/4th and 1/6th the diameter of the deposit being made to ensure consistent release from the tip and to avoid blocking of the tip by hitting the product. If the gap is too small, the tip can be blocked. If the gap is too large, the paste can remain stuck to the dispense tip.