From Ironwood Electronics, Inc.

SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The PCB should have mounting and alignment holes at proper locations (see page 2 of the drawing for recommended PCB layout information). The typical SS-BGA socket footprint is only 5mm larger than the maximum IC size. It is compatible with the alternate SG-BGA (elastomer) socket footprint. If there are pre-existing holes in the PCB, an SS-BGA socket can be custom designed to accommodate those holes

Read the Whole Article

Products & Services
IC Package Converters and Adapters
IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets.
IC Pin Probes
IC pin probes are used to test integrated circuits (ICs).
Flexible Circuits
Flexible circuits use polyimide films and other foldable substrates to meet the requirements of complex electronic manufacturing applications.
PCB Pins and Receptacles
PCB pins and PCB receptacles are electronic interconnect devices for printed circuit boards (PCB). PCB pins are male connectors. PCB receptacles are female connectors.
IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.

Product Announcements
Advanced Interconnections Corp. - Flip-Top BGA Test Socket for 0.50mm Pitch Devices
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the... (read more)
Advanced Interconnections Corp. - Surface Mount Sockets
Surface mount sockets from Advanced are available in footprints from 0.50mm to 1.27mm pitch. Sockets feature industry-proven solder ball terminals in either eutectic Tin/Lead or RoHS Compliant... (read more)
Advanced Interconnections Corp. - BGA Socket Adapter System
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after... (read more)
Advanced Interconnections Corp. - Flip-Top™ BGA Socket
Advanced Interconnections' Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for... (read more)
Advanced Interconnections Corp. - Peel-A-Way® - Removable Socket Terminal Carriers
Peel-A-Way® Removable Socket Terminal Carriers from Advanced Interconnections. Peel-A-Way® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The... (read more)
Advanced Interconnections Corp. - Peel-A-Way® DIP Socket Terminal Carriers
Peel-A-Way® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed... (read more)
Advanced Interconnections Corp. - Interposers: Package Conversion & Lead-free Issues
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder... (read more)
Advanced Interconnections Corp. - Low Profile SMT Connectors
Mezza-pede® low profile 1mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. (read more)
Advanced Interconnections Corp. - SIP Headers & Sockets for Power Modules/Converters
Single In-line (SIP) molded headers and sockets feature high quality screw-machined terminals for reliable socketing of power modules and converters. More Information... (read more)
 

Topics of Interest

The IC package drawing is required to select the correct GHz socket. Go to www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket"...

Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as...

Components and Test Board The packages used for this study are shown in Table I. It can be seen that there are many different sizes, pin-counts, lead-finishes and solder ball types for these...

A receptacle carrier is a convenient way to pick-up and place individual sockets (receptacles) as a group. It is essentially an assembly fixture having an array of protruding pins onto which...

The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible. This allows the IC to function...