From Fundamentals of Microsystems Packaging
Dr. Rajeshuni Ramesham Jet Propulsion Laboratory/ California Institute of Technology
Dr. Reza Ghaffarian Jet Propulsion Laboratory/ California Institute of Technology
Prof. Farrokh Ayazi Georgia Institute of Technology
Describe the MEMS applications
Introduce the fundamental terminology of MEMS devices and packaging
Describe MEMS packaging requirements and options
Describe the key failure mechanisms of MEMS
Present a case study on MEMS inertial sensors
Describe the future MEMS trends
MEMS is the fourth technology wave behind the Microsystem and Information Revolution that is underway. Even though it is not a fundamental building block like the transistor, it is capable of adding synergy to microminiaturize and bring about the key noncomputing functions of systems such as actuating and sensing. The technology is already used in a number of automotive and medical industries. In addition, it is beginning to form the base of microelectronic and photonic functions, such as RF and Optical MEMS.
14.1 WHAT ARE MEMS?
In the United States, the technology described in this chapter is known as micro-electro-mechanical systems (MEMS), in Europe as microsystems technology (MST), and in Japan as micromachines. MEMS are integrated microdevices, or systems combining electrical, mechanical, fluidic, and optical components and all physical domains. MEMS are fabricated using integrated circuit (IC) compatible batch-processing techniques, which range in size from micrometers to millimeters. These systems merge computation with sensing and actuation to change the way we perceive and control the physical world. MEMS,...
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