BOOK_CONTENT
From Fundamentals of Microsystems Packaging

Dr. Rajeshuni Ramesham Jet Propulsion Laboratory/ California Institute of Technology

Dr. Reza Ghaffarian Jet Propulsion Laboratory/ California Institute of Technology

Prof. Farrokh Ayazi Georgia Institute of Technology

CHAPTER OBJECTIVES

  • Introduce MEMS

  • Describe the MEMS applications

  • Introduce the fundamental terminology of MEMS devices and packaging

  • Describe MEMS packaging requirements and options

  • Describe the key failure mechanisms of MEMS

  • Present a case study on MEMS inertial sensors

  • Describe the future MEMS trends

CHAPTER INTRODUCTION

MEMS is the fourth technology wave behind the Microsystem and Information Revolution that is underway. Even though it is not a fundamental building block like the transistor, it is capable of adding synergy to microminiaturize and bring about the key noncomputing functions of systems such as actuating and sensing. The technology is already used in a number of automotive and medical industries. In addition, it is beginning to form the base of microelectronic and photonic functions, such as RF and Optical MEMS.

14.1 WHAT ARE MEMS?

In the United States, the technology described in this chapter is known as micro-electro-mechanical systems (MEMS), in Europe as microsystems technology (MST), and in Japan as micromachines. MEMS are integrated microdevices, or systems combining electrical, mechanical, fluidic, and optical components and all physical domains. MEMS are fabricated using integrated circuit (IC) compatible batch-processing techniques, which range in size from micrometers to millimeters. These systems merge computation with sensing and actuation to change the way we perceive and control the physical world. MEMS,...

Copyright The McGraw-Hill Companies, Inc. 2001 under license agreement with Books24x7

Products & Services
MEMS Devices
MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer.
MEMS Processing Equipment
MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers.
MEMS Foundry
MEMS foundry services suppliers design and manufacture microelectromechanical devices on a contract basis, in prototype to production quantities.
Lithography Equipment
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Optical and Optoelectronic Assembly Services
Optical assembly and optoelectronic assembly services companies design assemblies and systems for optical and optoelectronic devices.

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