From Integrated Circuit Packaging, Assembly and Interconnections

D

DEFECT
An anomaly that is in non-conformance with normally accepted characteristics.
DEFINITION
The sharpness of a deposited pattern, or the exactness with which a feature is patterned with respect to the intended design.
DEGRADATION
A debilitating change in a material characteristic or a device performance.
DENSITY
In packaging: Refers to the number of components on a circuit or board or the amount of conductor circuitry on a device package, a substrate or board.
DEVICE
A bare die (an element) or a packaged component.
DEWETTING
A condition that results when molten solder has coated a surface and upon cooling recedes leaving areas of uncovered base material.
DICE
Plural of die.
DIE
An unpackaged semiconductor, e.g. a diode, transistor or an integrated circuit, separated from a wafer. Also referred to as a bare die or a chip.
DIE ATTACH
Bonding of semiconductor die to a package/substrate. Same as die bonding.
DIE ATTACH
Adhesive attachment of a semiconductor die to a package/substrate. Can be thermally conductive or non-thermally conductive.
DIE BONDING
The process of attaching a semiconductor die to a package, substrate or board with a eutectic or solder alloy.
DIE BONDER
The machine used for die bonding.
DIELECTRIC
Any material that does not conduct electricity, an insulator, such as glass, ceramic or epoxy. Sometimes used to refer to a nonconducting ink or paste.
DIELECTRIC...
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Products & Services
Electronic and IC Packaging Services
Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices.
Foam Bonding Tapes
Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials.
IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Topics of Interest
E

E EDGE DEFINITION/EDGE ACUITY The sharpness of a pattern deposited by a thick film or thin film process. See Definition. ELECTRICAL ISOLATION Separating two or more conductors from each other by means...

B

B BACK END In semiconductor manufacturing the point at which all wafer processing has been completed and testing, assembly and packaging begins. BAKE Subjecting a part, package, board, substrate or an...

F

F FAILURE ANALYSIS A process to determine reasons why a device, circuit or assembly does not meet performance specifications. FAILURE MECHANISM A process intended to determine cause for the failure of...

Ken Gilleo Cookson Electronics 21.0 INTRODUCTION The semiconductor die or chip typically is bonded to a substrate for several critical reasons. First, an unattached die is subject to much greater...

OVERVIEW Adhesives used in the assembly of electronic circuits serve four main functions: Mechanically attach parts such as semiconductor die, components, substrates, packages, and heat sinks.