From Integrated Circuit Packaging, Assembly and Interconnections
- An anomaly that is in non-conformance with normally accepted characteristics.
- The sharpness of a deposited pattern, or the exactness with which a feature is patterned with respect to the intended design.
- A debilitating change in a material characteristic or a device performance.
- In packaging: Refers to the number of components on a circuit or board or the amount of conductor circuitry on a device package, a substrate or board.
- A bare die (an element) or a packaged component.
- A condition that results when molten solder has coated a surface and upon cooling recedes leaving areas of uncovered base material.
- Plural of die.
- An unpackaged semiconductor, e.g. a diode, transistor or an integrated circuit, separated from a wafer. Also referred to as a bare die or a chip.
- DIE ATTACH
- Bonding of semiconductor die to a package/substrate. Same as die bonding.
- DIE ATTACH
- Adhesive attachment of a semiconductor die to a package/substrate. Can be thermally conductive or non-thermally conductive.
- DIE BONDING
- The process of attaching a semiconductor die to a package, substrate or board with a eutectic or solder alloy.
- DIE BONDER
- The machine used for die bonding.
- Any material that does not conduct electricity, an insulator, such as glass, ceramic or epoxy. Sometimes used to refer to a nonconducting ink or paste.
Products & Services
Die bonders permanently attach a semiconductor die or chip to a package or substrate.
Topics of Interest
E EDGE DEFINITION/EDGE ACUITY The sharpness of a pattern deposited by a thick film or thin film process. See Definition. ELECTRICAL ISOLATION Separating two or more conductors from each other by means...
B BACK END In semiconductor manufacturing the point at which all wafer processing has been completed and testing, assembly and packaging begins. BAKE Subjecting a part, package, board, substrate or an...
F FAILURE ANALYSIS A process to determine reasons why a device, circuit or assembly does not meet performance specifications. FAILURE MECHANISM A process intended to determine cause for the failure of...
Ken Gilleo Cookson Electronics 21.0 INTRODUCTION The semiconductor die or chip typically is bonded to a substrate for several critical reasons. First, an unattached die is subject to much greater...
OVERVIEW Adhesives used in the assembly of electronic circuits serve four main functions: Mechanically attach parts such as semiconductor die, components, substrates, packages, and heat sinks.