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Power Handling of AIN vs. Al203
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Power Handling of AIN vs. Al203
 
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Power Handling of AIN vs. Al203
From International Manufacturing Services, Inc.
 

 
Thermal conductivity of a ceramic substrate is an important element when considering the differences between AlN (aluminum nitride) and Al2O3 (alumina). A brief explanation and basic equations follow. The thermal conductivities of each of the ceramics are: [1] Kn = 170-190 (W/m °C) AlN [2] Ka = ~25 (W/m °C) Al2O3 (at 25 °C) Where W is power in watts. The range given for aluminum nitride corresponds to the fact that K varies depending on the temperature of the substrate. Typical values at some temperatures are given below: [2a] Kn = 180 @ T = 25 °C [2b] Kn = 150 @ T = 100 °C [2c] Kn = 125 @ T = 200 °C

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Ceramic powders and precursors contain oxides, carbides, nitrides, carbon, and other non-metals. They are usually micron or mesh-size in distribution. Ceramic powders, sol-gel solutions and precursors are fabricated through atomization, crushing, milling, precipitation, and other chemical processes.
Specialty ceramics include nitrides, borides, carbon or graphite and silicides as well as other specialized non-metallic compounds.
Sapphire materials and components consist of a single-crystal, ceramic form of aluminum oxide. They have superior hardness, mechanical and optical properties, and are used in jewel bearings, lasing rods, wear parts, wafer substrates and optics.
Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating.
Aluminum oxide and alumina ceramics have excellent wear characteristics, chemical resistance, compressive strength, high-temperature properties, and dielectric strength.
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Topics of Interest
Frequently, one needs more power in a chip of a given size. The question regarding IMS chip resistors then becomes whether or not to choose aluminum nitride (ALN) chips, or alumina (Al2O3) chips in... (Read More)
Nitride ceramics are compounds of a metal or metalloid (Si, B) and nitrogen such as titanium nitride (TiN), silicon nitride (Si3N4), boron nitride (BN) or aluminum nitride (AlN). Nitrides are... (Read More)
Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate... (Read More)
Alumina or aluminum oxide (Al2O3) is a compound that consists of aluminum and oxygen. It is typically used in the alpha alumina structural form. In its pure form, alumina is a white ceramic material... (Read More)
Alumina (also known as Aluminum Oxide, Al2O3) is an extremely good electrical insulator with fantastic thermal properties – for this reason it is often used in the electronics sector for thin film... (Read More)
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Technical Articles
Power Handling of AIN vs. Al203 (.pdf) - Passive Electronic Components
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