Electrostatic discharge (ESD) is a natural phenomenon that affects virtually every production facility in one way or another. As semiconductor devices become smaller and more sensitive, the list of devices susceptible to damage by electrostatic discharge continues to grow. Many companies accept static damage as inevitable, writing off these losses in rework, customer returns, field service, warranty costs and ultimately in higher prices to their customers. Static, however, can be predicted, measured, generated in a controlled fashion, suppressed, channeled, shielded against and, most important, prevented. In the following, a discharge circuit is formulated from empirical test data and pertinent literature. It will be shown that stored charges sufficient to produce device damage are present at all levels of production flow and recommendations are presented for reducing ESD damage. Mistakes often made in ESD control procedures are also given.