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Microvias: For Low Cost, High Density Interconnects
By S. W. Ricky Lee
Microvias: For Low Cost, High Density Interconnects Offering a thorough look at the technology that s changing the nature of printed circuit boards and driving the mobile electronic revolution, this text details mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and more. Table of Contents
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Copyright The McGraw-Hill Companies, Inc. 2001 under license agreement with Books24x7
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