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AN0007 Stack Chip Components Handling and Usage

From Syfer Technology Limited
 

 
A selected number of components are available 'Tape and Reel' packed. The storage and handling of these components is as for normal chip capacitors. Unless supplied 'Tape and Reel' packed, all stack chip components will be supplied packed in a protective foam environment in individual cells, to prevent damage by contact during transportation. It is recommended that the components are stored in the original packing until used. If stored in the original packing, the components should be able to withstand all reasonable handling associated with transportation. When removing components from the packaging, care must be taken to prevent damage to the legs due to snagging. The recommended method of removal is: Carefully remove the foam packing pieces individually from the box. When the loaded packing piece is on the bench, gently push each component from the packing piece onto the bench. Do not allow the components to drop. It is preferable to place empty packing pieces on the bench, so as to protect units as they are removed.
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Topics of Interest
Causes of Packing Failures There are several common factors that may lead to premature packing failure. Some of these are as follows. Unacceptable leakage through the packing may be attributable to:... (Read More)
All SMD packed in Tape and Reel is Dry Packed. This method helps to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability... (Read More)
Tape reel assembly is a packing method which includes a composite carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This tape is then... (Read More)
This application note describes the tape and reel packaging used with M/A-COM's LSM1A package style VCOs. Tape and reel is the standard packaging for supplying product in volume quantities, small... (Read More)
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