From Ironwood Electronics, Inc.

IC Socket industry trends are impacted by a combination of technology and market- driven factors. Technology driven factors include miniaturization, increased pin counts, faster operating speeds, higher operating temperatures, and higher current carrying capabilities. Market driven factors include increased durability, shorter development cycles, and the need for more cost effective
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Products & Services
IC Package Converters and Adapters
IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets.
IC Pin Probes
IC pin probes are used to test integrated circuits (ICs).
Flexible Circuits
Flexible circuits use polyimide films and other foldable substrates to meet the requirements of complex electronic manufacturing applications.
IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
PCB Pins and Receptacles
PCB pins and PCB receptacles are electronic interconnect devices for printed circuit boards (PCB). PCB pins are male connectors. PCB receptacles are female connectors.

Product Announcements
Hypertac - Mini HyperGrip®
HyperGrip mini circular connectors (HG0) are available with 5 pin positions and have a user-configurable keying system, which allows customers to build connectors with six different keying options... (read more)
Hypertac - Mini HyperGrip®
HyperGrip mini circular connectors (HG0) are available with 5 pin positions and have a user-configurable keying system, which allows customers to build connectors with six different keying options... (read more)
Advanced Interconnections Corp. - Flip-Top BGA Test Socket for 0.50mm Pitch Devices
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the... (read more)
Hypertac - N Series Rack & Panel Connectors
The N Series provides a high density, modular rack & panel connector solution that includes coax and high current contacts up to 25 amps, and allows for up to 900 contact positions. This series of... (read more)
Samtec Inc. - High Density .5mm Pitch Edge Card Socket
Samtec has expanded its line of high speed edge card solutions to include a new high density socket featuring a bi-level mating design, two levels of contacts on a staggered 1mm (.0394") centerline,... (read more)
Carlisle Interconnect Technologies - Octax Ultra High-Speed Ethernet Interconnect
Carlisle Interconnect Technologies (CarlisleIT) is pleased to introduce the Octax™ Ultra High-Speed Ethernet Interconnect Solution, the world's fastest and lightest aerospace Ethernet... (read more)
ITT Cannon - Nemesis line of Mini-Circular Connectors
The ITT Interconnect Solutions Nemesis product range is the most comprehensive small plan-form range of connectors available in the marketplace. The range has been developed to meet and exceed the... (read more)
 

Topics of Interest

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3 THE IC PACKAGE [1,2] Starting with the transistor, the package has functioned as both a carrier and as an enclosure. As a carrier it allows the device s functionality to be fully accessed and to...