From Indium Corporation
Selection of the appropriate powder size for a specific solder paste application is an elemental step that will ultimately affect the printability of the solder paste with regard to the stencil design.
The stencil design plays an even more crucial role in solder paste printability and should be given considerable thought with the Area Ratio as a major focus.
Topics of Interest
Paste hang up is when solder paste adheres to the squeegee blade after lift-up from stencil.
13.10 Solder Pastes for SMDS Solder pastes, often called solder creams, are used in "reflow-soldering" of surface mount components, where the application of solder and the heat supply are separate...
The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder...
There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single...
This technical note is intended to provide information about Kionix's 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on...