From Developments in Surface Contamination and Cleaning: Fundamentals and Applied Aspects
- Chapter 14: The Use of Surfactants to Enhance Particle Removal from Surfaces
- Chapter 15: Cleaning with Solvents
- Chapter 16: Removal of Particles by Chemical Cleaning
- Chapter 17: Cleaning Using a High-speed Impinging Jet
- Chapter 18: Microabrasive Precision Cleaning and Processing Technology
- Chapter 19: Cleaning Using Argon/Nitrogen Cryogenic Aerosols
- Chapter 20: Carbon Dioxide Snow Cleaning
- Chapter 21: Coatings for Prevention or Deactivation of Biological Contamination
- Chapter 22: A Detailed Study of Semiconductor Wafer Drying
Michael L. Free
Department of Metallurgical Engineering, University of Utah, Salt Lake City, UT, USA
14.1.1 Industrial Perspective
Many of the items we use daily must be manufactured in environments that require particulate materials, yet the particles that are essential to production must be removed to extremely low levels following the relevant manufacturing processes. A single particle remaining at a critical place on a semiconductor circuit during the manufacturing process can cause circuit failure in a finished integrated circuit. Consequently, particle removal technologies are vital to electronic circuit manufacturing [1 18]. Other industries such as optical component manufacturing also rely upon particle removal technologies to create quality components with appropriate finishes.
In many industries, particles are handled in aqueous media, and particle removal from surfaces is also performed in aqueous media. Removal techniques vary from simple brush scrubbing techniques [19 22] and megasonic vibration [23 26] for wet surfaces to laser treatment [27 30] and snow [31 32] or air  cleaning for dry surfaces.
Particles adhere to surfaces due to natural attractive forces between particles and surfaces.
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Topics of Interest
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