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IBM, Toppan ink mask deal IBM and Toppan Printing have agreed to invest $200 million in a joint development program for 45-nm photomasks. Development work will take place at IBM's Burlington, VT,...
Our customer receives the nine-inch long lead frames with a burr from the stamping die-break as well as sharp corners. The copper is 0.20" thick and very fragile, plus the design is complex.
There was a time when most intercity mail was transported by rail. As a train moved from city to city, clerks in a special car sorted the mail for drops at the next destination. The clerks were armed...
M/A Com is committed to full compliance with the RoHS (Restriction of the use of certain Hazardous Substances) and WEEE (Waste from Electrical and Electronic Equipment) directives. M/A Com began the...
Daniel F. Baldwin, Ph.D. 17.0 INTRODUCTION One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology.