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Hear this: CMOS microphones on a chip

 

 
First comes single-chip microphones in silicon. Next will come a variety of inexpensive sensors made with the same basic integrated circuit technology and in high volumes. Akustica's CMOS microphone chip is just 2.5 mm2. It is going into PCs and may soon find its way into cell phones and video cameras. A scanning electron microscope image of the diaphragm on the Akustica microphone chip shows the serpentine pattern created in the chip's metal and oxide layers. The special structure is necessary to
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MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer. Learn more about MEMS Devices
Measurement microphones are most commonly condenser microphones, which convert sound pressure to an output that is then converted into a reading such as sound pressure level (SPL). Search by Specification | Learn more about Measurement Microphones
Low light cameras are designed for low light applications. They contain sensors that are highly sensitive to light and reduce images to a series of lines. Search by Specification | Learn more about Low Light Cameras
High speed cameras are designed for rapid image acquisition for scientific or industrial analysis of rapidly changing or moving processes. Search by Specification | Learn more about High Speed Cameras
Complementary metal oxide semiconductor (CMOS) cameras use image sensors that operate at lower voltages than charged coupled devices (CCDs), reducing power consumption for portable applications. Each CMOS active pixel sensor cell has its own buffer amplifier, and can be addressed and read individually.  Search by Specification | Learn more about CMOS Cameras
Product Announcements
Micro Optics Technologies, Inc. - Fiber Optic Microphone System Selection
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Polytec, Inc. - Laser Vibrometry in Hearing Mechanics and Otology
The human ear is one of the most sophisticated sound and vibration amplification sys­tems. State-of-the-art Laser-Doppler vibrometers reveal the vibrational and dynamic characteristics of hearing... (read more)
Micro Optics Technologies, Inc. - Fibersound Microphone Drivers
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ARC Technologies, Inc. - Wave-X
Absorption Materials for Interference Control... (read more)
International Components Corporation - Electret Condenser Microphone Elements
The Intervox electret condenser microphone line consists of a diversified range of products that include omnidirectional, unidirectional and noise cancelling types. By using the finest materials these... (read more)
ISL Products International Ltd. - COMPONENT MICROPHONES
ISL Products specializes in standard and custom speakers, condenser, noise canceling and omnidirectional microphones, cable and harness assembly, piezo transducers and buzzers as well as other popular... (read more)
Universal Semiconductor, Inc. - Turn Key wafer fab capabilities
Universal Semiconductor (USI) expands its Turn Key wafer fab capabilities to include 6" wafer now offering 2', 3", 4", 5" and 6" wafer foundry services. USI's expanded lithography equipment includes... (read more)
Keller America, Inc. - Piezoresistive OEM Pressure Transducers
The series 3L - 10L is a new range of laser-welded, media isolated transducers that benefit from smaller capsule dimensions and crevice free diaphragms. This new design still retains all the... (read more)
ROHM Semiconductor, USA LLC - High-precision Thin-film Chip Resistors: MHR03
ROHM has introduced a new line of high accuracy ±0.5% thin-film chip resistors. MHR03 utilizes thin film technology, which provides a stable temperature coefficient and guards against low-current... (read more)
 
Topics of Interest
Chapter List Chapter 16: Microphones Chapter 17: Loudspeakers Chapter 18: Loudspeaker Cluster Design by Glen Ballou 16.1 Introduction Every sound source has different... (Read More)
CHAPTER LIST Chapter 1: RF System Integration Chapter 2: RF System Board Level Integration for Mobile Phones Chapter 3: Integration of RF Systems on a Chip Chapter 4: Towards the Full... (Read More)
A.FAES, F.GIACOMOZZI, B.MARGESIN AND M.ZEN ITC-irst, Microsystems Division via Sommarive 18, 38050 Povo (TN), Italy E-mail: alesfaes@itc.it This work deals with the design of a silicon... (Read More)
The following abbreviations are used in this book: AB antibonding AC alternating current AFM atomic force microscopy ALE atomic layer epitaxy BESOI... (Read More)
Overview In the early days of recording, artists crowded around a horn leading to a diaphragm-driven stylus cutting a groove on a wax cylinder. In early radio dramatics, actors, actresses, and... (Read More)
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